Grain growth region in gold wire ball bonding

Date

4-1996

Degree

Bachelor of Science in Applied Physics

College

College of Arts and Sciences (CAS)

Adviser/Committee Chair

Demetrio A Yco, Jr.

Abstract

An equipment to simulate the grain growth region of gold bonding wires was developed. Such equipment was used to obtain "free air ball" samples to characterize the grain growth region of the gold wires. The samples taken from the simulator were first microsectioned by encapsulating them using mold encapsulant and then submerging them to aqua regia solution. The procedure, however, yielded a very low success rate. Thus, the gold wire samples were directly etched by dipping them in the aqua regia solution. Metallographic investigation was carried out by observing them under the scanning electron microscope Tensile strength readings were taken by wire pull test of bonded wires under the same current setting with the simulator and was correlated to the measured grain size number. It was found out that the grain size number is inversely proportion to the tensile strength of the gold wires.

Language

English

Location

UPLB Main Library Special Collections Section (USCS)

Call Number

Thesis

Document Type

Thesis

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