Reduction of defects through total quality management at the production area III of Minami Machineries and Electronic Technologies Incorporated, Cabuyao, Laguna

Date

4-2010

Degree

Bachelor of Science in Industrial Engineering

College

College of Engineering and Agro-Industrial Technology (CEAT)

Adviser/Committee Chair

Marc Immanuel G. Isip

Committee Member

Romark O. Cayube, Kathleen B. Lee

Abstract

Minami Machineries and Electronics Technologies (MMET), Incorporated is located at Light Industry and Science Park 1, Bo. Diezmo, Cabuyao Laguna, Philippines. MMET Inc. is one of the exporters of mounted printed circuit boards (PCBs) for advanced electronics applications in the Philippines. The company is involved with Surface Mounting Technology and Electronic Manufacturing Services work. The company assembles, packages, and delivers PCBs to customers. MMET Inc. has three production areas. On their three production areas, a significant number of defects, reworkable and non-reworkable, on the processed PCBs have been detected. From the three production areas, the area in which most defects occurred was traced and was found to be at the production area III- the area where PCB models for the customer FTCP are being produced. This area contributed seventy-eight percent (78%) of all the defects for 14-months duration. With this, the major concern of the study is the high number of defect occurrence. Therefore, this study aims to reduce the defects on the production area III of MMET Inc. The assignable causes of high number of defects were identified using Ishikawa Diagram and the root causes were analyzed using CNX analysis. These causes were then classified into controllable, noise, and experimental factors. Some quantifiable factors such as solder paste weight, temperature and mixing stroke, and tension gauge reading were tested for significance on the occurrence of defects using statistical analyses. One-Way ANOVA revealed that the solder paste weight and tension gauge reading have a significant effect on the amount of defects. The method 2² Factorial revealed that the mixing stroke has a significant effect on the amount of defects per level, while room temperature has no significant effect on the amount of defects per level. The controllable factors were grouped accordingly into three. The group A factors are those factors that are related to stricter implementation of rules and Standard Operating Procedures of workers. Group B factors are related to the stricter supervision of management during production. The Group C factor is related to the implementation of incentives or reward system. The experimental factors were given detailed solutions and were no longer grouped accordingly. The experimental factors include no standard method for weighing of solder paste, no standard process of checking components in the mounter, confused operator on the model being run, mounter height not defined on parts library, no proper shift turn-over, old reflow oven machine, worn-out stencil, and unavailability of operators. The alternatives for each factor were generated and was found that the problem on having no standard method for weighing the amount of solder paste to be applied in the printer can be solved by purchasing a digital weighing machine for proper weighing of solder paste in the printing process. The problem on having no standard process of checking components in the mounter can be solved by providing a work-eye of the printed mounter table top view with highlight on inspection points for presence of pins. The confusion of operator on the model being run can be prevented by formulating periodic oral and written knowledge checks and review among operators. The problem on the mounter height not defined on parts library can be given solution by adding a column data of required mounter height on the parts of each model. For shift turn-over, the current system must be maintained. The problem on worn-out stencil can be prevented by buying a set of stencils for back-up. The problem on the unavailability of operator can be solved by hiring an additional operator. After the evaluation of the alternatives, it was found that purchasing a digital weighing machine for proper weighing of soler paste can reduce the defect lack soler. Providing a work-eye of the printed mounter table top view with highlight on inspection points for presence of pins can reduce on shifted parts. Periodic oral and written knowledge checks and review among operators, and posting on machines of the data on the model being processed can reduce the defects shifted and excess parts. Adding a column data of required mounter height on the parts library of each model can reduce the defect lifted components. Buying a new reflow machine can reduce the defects non-wetting and lifted part. Buying a set of stencils can reduce the defects solder bridging and solder balling. Hiring an additional operator can reduce the defects excess part, shifted, lifted, non-wetting, solder bridging, and solder balling in the production.The recommendations will require an initial investment of PhP502, 365 while having a savings of PhP9,203,368.

Language

English

Location

UPLB College of Engineering and Agro-Industrial Technology (CEAT)

Call Number

LG 993 2010 E66 P33

Document Type

Thesis

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