Temperature profiling of reflow oven used at SSCG Site 2 Automotive Department of Integrated Micro-electronics Inc.

Author

Kristoffer Jun B. Haguingan, University of the Philippines Los Baños

Date

1-2012

Degree

Bachelor of Science in Electrical Engineering

Major Course

Major in Electronics Engineering

College

College of Engineering and Agro-Industrial Technology (CEAT)

Adviser/Committee Chair

Adrian Augusto M. Sumalde

Committee Member

John Paolo A. Ramoso, Dennis L. Enciso, John D.G. Agsalud

Abstract

The Integrated Micro-Electronics Inc. is one of the leading electronic manufacturing service provides in the country. The key features of the company are its flexibility, discipline and devotion to provide customer satisfaction. They maintain a high level of quality in their products.In their surface mount assembly lines, the use of reflow soldering is very dominant. Almost all lies use reflow ovens. Due to this matter, their profiling procedure should be well-organized and systematic. The profiling is done to arrive at an oven profile that will yield optimum level of solder quality at the same time minimizing production cost. By studying temperature profiling, the efficiency of the reflow soldering and oven can be improved. Improving the oven efficiency means improving its output's quality and minimizing production cost.

Language

English

LC Subject

Solder and soldering, Reliability (Engineering)

Call Number

LG 993 2012 E64 H34

Notes

Field practice report.

Recommended Citation

Haguingan, Kristoffer Jun B., "Temperature profiling of reflow oven used at SSCG Site 2 Automotive Department of Integrated Micro-electronics Inc." (2012). Undergraduate Theses. 10.
https://www.ukdr.uplb.edu.ph/etd-undergrad/10

Document Type

Thesis