Failure analysis of Plastic Dual Inline Packages 16L (PDIP) at Cirtek Electronics Corporation
Date
2011
Degree
Bachelor of Science in Electrical Engineering
College
College of Engineering and Agro-Industrial Technology (CEAT)
Adviser/Committee Chair
John, DG., Agsalud
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Abstract
Failure Analysis is the process of determining how and why a semiconductor device failed and often performed as a series of steps known as failure analysis techniques. In the study, the failure analysis techniques that were discussed and analyzed by the author included External Visual Inspection, Electrical Verification, X-ray Inspection, Scanning Acoustic Microscopy (SAM) Inspection, Decapsulation, Cross Sectioning, Scanning Electron Microscopy (SEM) Inspection and Etch Testing. A complete failure analysis report which contained visual confirmation of the defect, observations for each failure analysis technique completed, conclusion and recommendations by the failure analysis engineer who evaluated the semiconductor device was also discussed in the study. Pertinent data related to failure analysis techniques that were considered by the author were observed from the semiconductor production and packaging facility owned by Cirtek Electronics Corporation located at Technopark, Sta. Rosa, Laguna, Philippines.
Language
English
Location
UPLB College of Engineering and Agro-Industrial Technology (CEAT)
Recommended Citation
Tobias, Franz Xyrlo I., "Failure analysis of Plastic Dual Inline Packages 16L (PDIP) at Cirtek Electronics Corporation" (2011). Undergraduate Theses. 2428.
https://www.ukdr.uplb.edu.ph/etd-undergrad/2428
Document Type
Thesis
