Surface mount component placement process using Panasonic CM402 at SSCG Site 2 Automotive Department of Integrated Micro-Electronics Inc.

Date

5-2012

Degree

Bachelor of Science in Electrical Engineering

College

College of Engineering and Agro-Industrial Technology (CEAT)

Adviser/Committee Chair

Adrian Augusto M. Sumalde

Abstract

Surface mount component placement process is a crucial procedure being done in almost all electronic manufacturing companies. This process gives companies such as Integrated Micro-Electronics Inc. the advantage of manufacturing products with high accuracy and efficiency. Due to this, IMI continues to invest money to develop this process more. The process of placing components onto a printed circuit board dictates how short the manufacturing time is. The component process greatly depends on several factors such as the efficiency and features of placement machine, available types of feeders, vision capabilities and others. The Automotive Department of IMI utilizes Panasonic CM402 for component placement in their assembly lines. Developing this process and optimizing its capabilities will lessen manufacturing time, minimize production cost and improve quality.

Language

English

Location

UPLB College of Engineering and Agro-Industrial Technology (CEAT)

Call Number

LG 993 2012 E64 /A38

Document Type

Thesis

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